Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11162191 | Thermal processing method for silicon wafer | Susumu Maeda, Hironori Banba, Hideyuki Okamura, Koji Araki, Koji Sueoka +1 more | 2021-11-02 |
| 11060983 | Evaluation method of silicon wafer | Nobue Araki, Kazuki Okabe, Koji Araki | 2021-07-13 |