HO

Hideyuki Okamura

GC Globalwafers Japan Co.: 1 patents #3 of 11Top 30%
Overall (2021): #433,073 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11162191 Thermal processing method for silicon wafer Susumu Maeda, Hironori Banba, Haruo Sudo, Koji Araki, Koji Sueoka +1 more 2021-11-02