Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107784 | Semiconductor device having circuit board to which contact part is bonded | Rikihiro Maruyama, Masaoki MIYAKOSHI, Kazuya Adachi, Takeshi Yokoyama | 2021-08-31 |
| 11107787 | Member for semiconductor device | Shinji Sano, Yoshihiro Kodaira, Kazunaga Onishi | 2021-08-31 |