Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107784 | Semiconductor device having circuit board to which contact part is bonded | Rikihiro Maruyama, Masayuki Soutome, Kazuya Adachi, Takeshi Yokoyama | 2021-08-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107784 | Semiconductor device having circuit board to which contact part is bonded | Rikihiro Maruyama, Masayuki Soutome, Kazuya Adachi, Takeshi Yokoyama | 2021-08-31 |