Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164846 | Semiconductor device manufacturing method and soldering support jig | Rikihiro Maruyama, Kenshi Kai | 2021-11-02 |
| 11107784 | Semiconductor device having circuit board to which contact part is bonded | Rikihiro Maruyama, Masaoki MIYAKOSHI, Masayuki Soutome, Takeshi Yokoyama | 2021-08-31 |
| D926966 | Package for containing a micro needle patch | Takashi Shigeno, Manabu Ikarashi, Katsunori Kobayashi, Hidetoshi Hamamoto | 2021-08-03 |