| 11127633 |
Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-09-21 |
| 11088008 |
Wafer processing method |
Keisuke Yamamoto, Taichiro Kimura |
2021-08-10 |
| 11069574 |
Wafer processing method including applying a polyester sheet to a wafer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-07-20 |
| 11062948 |
Wafer processing method |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-07-13 |
| 11056334 |
Wafer processing method using a ring frame and a polyester sheet |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-07-06 |
| 11049772 |
Wafer processing method including applying a polyester sheet to a wafer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-06-29 |
| 11049757 |
Wafer processing method including applying a polyester sheet to a wafer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-06-29 |
| 11043421 |
Wafer processing method |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-06-22 |
| 11037814 |
Wafer processing method using a ring frame with a polyester sheet with no adhesive layer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-06-15 |
| 11037813 |
Wafer processing method |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-06-15 |
| 11031234 |
Wafer processing method including applying a polyolefin sheet to a wafer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-06-08 |
| 11024543 |
Wafer processing method including applying a polyester sheet to a wafer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-06-01 |
| 11018058 |
Wafer processing method for dividing a wafer along predefined division lines using polyester sheet |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-05-25 |
| 11018043 |
Wafer processing method using a ring frame and a polyester sheet |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-05-25 |
| 11011407 |
Wafer processing method using a ring frame and a polyolefin sheet |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-05-18 |
| 11004744 |
Wafer processing method for dividing a wafer along predefined division lines |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-05-11 |
| 10998232 |
Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-05-04 |
| 10991624 |
Wafer processing method including applying a polyolefin sheet to a wafer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-04-27 |
| 10991587 |
Wafer processing method including applying a polyester sheet to a wafer |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-04-27 |
| 10985066 |
Wafer processing method for dividing a wafer along division lines |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-04-20 |
| 10985067 |
Wafer processing method using a laser beam dividing step |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-04-20 |
| 10933618 |
Carrier plate removing method |
Katsuhiko Suzuki, Takatoshi Sakurai |
2021-03-02 |
| 10933500 |
Blade mounting and dismounting jig, blade mounting and dismounting method, blade extracting method, and cutting apparatus |
Hajime Kameda |
2021-03-02 |
| 10910269 |
Wafer processing method |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-02-02 |
| 10896850 |
Wafer processing method |
Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more |
2021-01-19 |