Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205580 | Method of manufacturing molded chip | — | 2021-12-21 |
| 11164783 | Manufacturing method of semiconductor device with metal film | — | 2021-11-02 |
| 11153975 | Wiring board manufacturing method | — | 2021-10-19 |
| 10998196 | Peeling method for peeling off substrate from support plate | — | 2021-05-04 |
| 10933618 | Carrier plate removing method | Takatoshi Sakurai, Hayato Kiuchi | 2021-03-02 |
| 10926524 | Removal method of carrier plate | — | 2021-02-23 |
| 10899046 | Composite member | Takeshi Yoshida | 2021-01-26 |