Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171166 | Camera assembly and packaging method thereof, lens module, electronic device | Mengbin Liu | 2021-11-09 |
| 11153973 | Electronic module | Kaipeng Chiang, Bau-Ru Lu, Chun-Hsien Lu | 2021-10-19 |
| 11069670 | Camera assembly and packaging method thereof, lens module, and electronic device | Mengbin Liu | 2021-07-20 |
| 11031255 | Stack frame for electrical connections and the method to fabricate thereof | Bau-Ru Lu, Yi-Cheng Lin | 2021-06-08 |
| 11017934 | Electronic module | Bau-Ru Lu, Chun-Hsien Lu | 2021-05-25 |
| 10991681 | Three-dimensional package structure | Chun-Tiao Liu, Chau-Chun Wen | 2021-04-27 |
| 10886315 | Photosensitive assembly and formation methods thereof, lens module, and electronic device | — | 2021-01-05 |
| 10887499 | Camera assembly and packaging methods thereof, lens module, and electronic device | Mengbin Liu | 2021-01-05 |