Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171166 | Camera assembly and packaging method thereof, lens module, electronic device | Da-Jung Chen | 2021-11-09 |
| 11069670 | Camera assembly and packaging method thereof, lens module, and electronic device | Da-Jung Chen | 2021-07-20 |
| 11049816 | Alignment mark and semiconductor device, and fabrication methods thereof | — | 2021-06-29 |
| 10930617 | Packaging method and package structure of wafer-level system-in-package | — | 2021-02-23 |
| 10887499 | Camera assembly and packaging methods thereof, lens module, and electronic device | Da-Jung Chen | 2021-01-05 |