Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991681 | Three-dimensional package structure | Da-Jung Chen, Chau-Chun Wen | 2021-04-27 |
| 10902989 | Packaging structure of a magnetic device | Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang | 2021-01-26 |