Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177077 | Electrolytic capacitor and method for manufacturing same | Masahiro Kajimura | 2021-11-16 |
| 11177229 | IC chip layout for minimizing thermal expansion misalignment | Naoki Hasegawa, Hiromasa Hiura, Yuichi Nakagomi | 2021-11-16 |
| 11079989 | Printing system, printing method, image forming apparatus and method for controlling the same, and computer-readable medium | — | 2021-08-03 |
| 10991668 | Connection pad configuration of semiconductor device | Tsuyoshi Koga, Naoki Hasegawa, Naoyuki Narita, Kiyotaka Miwa, Kazuhiko Sato +1 more | 2021-04-27 |
| 10957719 | Semiconductor device and a method of manufacturing the same | Akihiko Yoshioka | 2021-03-23 |
| 10943743 | Electrolytic capacitor and method for producing same | Hitoshi Fukui, Koji Okamoto, Makoto Nagashima | 2021-03-09 |