Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177229 | IC chip layout for minimizing thermal expansion misalignment | Naoki Hasegawa, Shinya Suzuki, Hiromasa Hiura | 2021-11-16 |
| 11171111 | Integrated circuit device and electronic device | Kazuhiro Okamura, Takeshi Okubo, Takefumi Seno | 2021-11-09 |
| 10991668 | Connection pad configuration of semiconductor device | Tsuyoshi Koga, Shinya Suzuki, Naoki Hasegawa, Naoyuki Narita, Kiyotaka Miwa +1 more | 2021-04-27 |