Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189600 | Method of forming sacrificial self-aligned features for assisting die-to-die and die-to-wafer direct bonding | Wei-E Wang, Mark S. Rodder | 2021-11-30 |
| 11158738 | Method of forming isolation dielectrics for stacked field effect transistors (FETs) | Wei-E Wang, Mark S. Rodder | 2021-10-26 |
| 10971420 | Method of forming a thermal shield in a monolithic 3-D integrated circuit | Wei-E Wang, Mark S. Rodder | 2021-04-06 |
| 10886224 | Power distribution network using buried power rail | Rwik Sengupta, Joon Goo Hong, Kevin Traynor | 2021-01-05 |