ZT

Zavier Zai Yeong Tan

Applied Materials: 1 patents #663 of 1,395Top 50%
Overall (2021): #190,712 of 548,734Top 35%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11011424 Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process Jungrae Park, James S. Papanu 2021-05-18