Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011424 | Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process | Zavier Zai Yeong Tan, James S. Papanu | 2021-05-18 |
| 10903121 | Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process | Karthik Balakrishnan, James S. Papanu | 2021-01-26 |