Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177187 | Sensor package and manufacturing method thereof | Ji Young Chung, Dong Joo Park, Jae Sung Park, Se Hwan Hong | 2021-11-16 |
| 11158582 | Semiconductor devices and methods of manufacturing semiconductor devices | Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim +2 more | 2021-10-26 |
| 11126313 | Touch display apparatus | Ju Han Kim, Yong Chan Park, Seung Kyeom Kim | 2021-09-21 |
| 11112451 | Test method for semiconductor devices and a test system for semiconductor devices | Chul Lee, Tae-Kyung Ko, Hyeong-Gon Son, Seung Woo Hong, Dong Gu Lee +1 more | 2021-09-07 |
| 11049828 | Electronic device with interconnection structure oblate ellipsoid-shaped aperture | Gyu Wan Han, Byong Woo Cho | 2021-06-29 |
| 11031356 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Byong Woo Cho, Cha Gyu Song | 2021-06-08 |