Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049828 | Electronic device with interconnection structure oblate ellipsoid-shaped aperture | Gyu Wan Han, Jin Seong Kim | 2021-06-29 |
| 11031356 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Cha Gyu Song | 2021-06-08 |