Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177187 | Sensor package and manufacturing method thereof | Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park | 2021-11-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177187 | Sensor package and manufacturing method thereof | Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park | 2021-11-16 |