Issued Patents 2021
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211332 | Molded die last chip combination | Milind S. Bhagavat | 2021-12-28 |
| 11197990 | Systems and methods for transcutaneous power transfer using microneedles | Gene A. Bornzin, Edward Karst | 2021-12-14 |
| 11178389 | Self-calibrating display device | Praveen Sinha, Seema Lal Gulabrani, Ajay Vellanki, Arun Mudiraj | 2021-11-16 |
| 11167123 | Coordinated ventricular assist and cardiac rhythm management devices and methods | Allison Connolly, Yelena Nabutovsky, Julie Prillinger | 2021-11-09 |
| 11093252 | Logical availability zones for cluster resiliency | Abhishek Chaturvedi, Bhargav Kosaraju, Arvind Pruthi | 2021-08-17 |
| 11087227 | Anomaly detection in spatial and temporal memory system | Jeffrey C. Hawkins | 2021-08-10 |
| 11030581 | Medical claims lead summary report generation | Gokul Subramanian, William Seaton, Diane Wu | 2021-06-08 |
| 11018125 | Multi-chip package with offset 3D structure | Milind S. Bhagavat, Gabriel H. Loh | 2021-05-25 |
| 11011495 | Multiple-die integrated circuit with integrated voltage regulator | Milind S. Bhagavat, David Hugh McIntyre | 2021-05-18 |
| 11011466 | Integrated circuit package with integrated voltage regulator | Milind S. Bhagavat, Chia-Hao Cheng | 2021-05-18 |
| 10942886 | Data transmission method and data transmission system | Alan Osamu Kobayashi, Sujan Thomas, Ramakrishna Chilukuri, Iyothsna Nagaraja | 2021-03-09 |
| 10930621 | Die stacking for multi-tier 3D integration | Milind S. Bhagavat | 2021-02-23 |
| 10923430 | High density cross link die with polymer routing layer | Chun-Hung Lin, Milind S. Bhagavat, Fei Guo | 2021-02-16 |