Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943880 | Semiconductor chip with reduced pitch conductive pillars | Milind S. Bhagavat, Lei Fu | 2021-03-09 |
| 10937755 | Bond pads for low temperature hybrid bonding | Milind S. Bhagavat | 2021-03-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943880 | Semiconductor chip with reduced pitch conductive pillars | Milind S. Bhagavat, Lei Fu | 2021-03-09 |
| 10937755 | Bond pads for low temperature hybrid bonding | Milind S. Bhagavat | 2021-03-02 |