Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10995239 | Polishing fluid for improving surfaces formed by fused deposition molding with abs and method of preparing same | Feng Xu, Yan Liu, Jipeng Zheng, Benjun Yu | 2021-05-04 | |
| 10943880 | Semiconductor chip with reduced pitch conductive pillars | Priyal Shah, Milind S. Bhagavat | 2021-03-09 | $152,021,000 |
| 10903168 | Multi-RDL structure packages and methods of fabricating the same | Milind S. Bhagavat, Farshad Ghahghahi | 2021-01-26 | $305,716,000 |