Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593690 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2020-03-17 |
| 10553604 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2020-02-04 |