Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818631 | Semiconductor structure and method of forming the same | Xinsheng Wang, Li Zhang, Gaosheng Zhang, Xianjin Wan, Ziqun Hua +4 more | 2020-10-27 |
| 10811380 | Semiconductor structure and forming method thereof | Xinsheng Wang, Li Zhang, Gaosheng Zhang, Xianjin Wan, Ziqun Hua +4 more | 2020-10-20 |
| 10790297 | Method for forming channel hole in three-dimensional memory device using nonconformal sacrificial layer | Baoyou Chen, Hai Huang, Zhuqing Huang, Guanping Wu, Hongbin Zhu +1 more | 2020-09-29 |
| 10593690 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2020-03-17 |