YL

Yi-Chia Lee

VU Versum Materials Us: 3 patents #4 of 41Top 10%
TSMC: 1 patents #1,818 of 3,471Top 55%
📍 Yanshuei, TW: #1 of 1 inventorsTop 100%
Overall (2020): #40,864 of 565,922Top 8%
4
Patents 2020

Issued Patents 2020

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10879076 Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/silicon stack during manufacture of a semiconductor device Wen Dar Liu, Andrew J. Adamczyk 2020-12-29
10870799 Etching solution for selectively removing tantalum nitride over titanium nitride during manufacture of a semiconductor device Wen Dar Liu 2020-12-22
10711227 TiN hard mask and etch residue removal Wen Dar Liu, William Jack Casteel, Jr., Tianniu Chen, Rajiv Krishan Agarwal, Madhukar Bhaskara Rao 2020-07-14
10556792 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen +2 more 2020-02-11