Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10865102 | Multi-depth MEMS package | Fan Hu | 2020-12-15 |
| 10752495 | Method for forming multi-depth MEMS package | Fan Hu | 2020-08-25 |
| 10618801 | MEMS structure with bilayer stopper and method for forming the same | Hsiang-Fu Chen, Fan Hu | 2020-04-14 |
| 10556790 | Method for forming multi-depth MEMS package | Fan Hu | 2020-02-11 |
| 10556792 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Ching-Kai Shen +2 more | 2020-02-11 |