Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861772 | Clamping mechanism for heat sink and electronic device assembly including the same | Wenyu Liu, Hongqiang Han, Hongwen Yang, Youwei Pan | 2020-12-08 |
| 10714865 | Connector housing with a connecting mechanism to prevent electromagnetic leakage near the insertion port | Wenyu Liu, Hongqiang Han, Youwei Pan | 2020-07-14 |