HY

Hongwen Yang

TC Tyco Electronics (Shanghai) Co.: 1 patents #56 of 123Top 50%
Overall (2020): #445,730 of 565,922Top 80%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10861772 Clamping mechanism for heat sink and electronic device assembly including the same Wenyu Liu, Hongqiang Han, Lizhou Li, Youwei Pan 2020-12-08