Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10829623 | High-strength conductive polymer composite formed by angular extrusion | Hayden H. Chun, David Cook, Eric S. Packer | 2020-11-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10829623 | High-strength conductive polymer composite formed by angular extrusion | Hayden H. Chun, David Cook, Eric S. Packer | 2020-11-10 |