Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10829623 | High-strength conductive polymer composite formed by angular extrusion | Douglas W. Van Citters, Hayden H. Chun, Eric S. Packer | 2020-11-10 |
| D883179 | Modular head badge | — | 2020-05-05 |