Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833045 | Substrate processing apparatus and manufacturing method of substrate holding unit | Munehisa KODAMA, Takashi Terada | 2020-11-10 |
| 10756046 | Bonding apparatus, bonding system, bonding method and storage medium | Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa | 2020-08-25 |