Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748867 | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Francisco Medina, David Espalin, Danny W. Muse | 2020-08-18 |
| 10691095 | In-situ diagnostics and control method and system for material extrusion 3D printing | Chi Yen Kim, David Espalin, Ryan Wicker | 2020-06-23 |
| 10660214 | Methods for connecting inter-layer conductors and components in 3D structures | Ryan Wicker, Francisco Medina, Danny W. Muse, David Espalin | 2020-05-19 |
| 10582619 | Apparatus for wire handling and embedding on and within 3D printed parts | David Espalin, Daniel Marquez, Alfonso Fernandez, Chiyen Kim, Ryan Wicker | 2020-03-03 |
| 10569464 | Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning | David Espalin, Isaac Varela, Ryan Wicker | 2020-02-25 |