Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748867 | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Eric MacDonald, Francisco Medina, David Espalin | 2020-08-18 |
| 10660214 | Methods for connecting inter-layer conductors and components in 3D structures | Ryan Wicker, Francisco Medina, Eric MacDonald, David Espalin | 2020-05-19 |