Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879154 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2020-12-29 |
| 10784190 | Method of making leadframe strip | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2020-09-22 |
| 10541225 | Methods of assembling a flip chip on a locking dual leadframe | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2020-01-21 |