Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879154 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim | 2020-12-29 |
| 10804114 | Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides | You Chye How | 2020-10-13 |
| 10720406 | Stacked semiconductor system having interposer of half-etched and molded sheet metal | Anis Fauzi bin Abdul Aziz, Khoo Yien Sien | 2020-07-21 |
| 10541225 | Methods of assembling a flip chip on a locking dual leadframe | Wei Fen Sueann Lim, Anis Fauzi Bin Abdul Aziz | 2020-01-21 |