Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692835 | Ball bond attachment for a semiconductor die | Zi Qi Wang, Chen Xiong, Yong Tang, Xi Li, Xiao Lin Kang | 2020-06-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692835 | Ball bond attachment for a semiconductor die | Zi Qi Wang, Chen Xiong, Yong Tang, Xi Li, Xiao Lin Kang | 2020-06-23 |