Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692835 | Ball bond attachment for a semiconductor die | Han Zhong, Zi Qi Wang, Chen Xiong, Yong Tang, Xiao Lin Kang | 2020-06-23 |
| 10679697 | Read circuit of storage class memory with a read reference circuit, having same bit line parasitic parameters and same read transmission gate parasitic parameters as memory | Yu Lei, Houpeng Chen, Qian Wang, Zhitang Song | 2020-06-09 |