Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879123 | Protected chip-scale package (CSP) pad structure | Chia-Chan Chen, Ching-Heng Liu | 2020-12-29 |
| 10734339 | Bond pad structure for bonding improvement | Chia-Chan Chen | 2020-08-04 |
| 10714516 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2020-07-14 |
| 10672810 | CMOS image sensor with shallow trench edge doping | Chia-Chan Chen | 2020-06-02 |