Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879123 | Protected chip-scale package (CSP) pad structure | Yueh-Chuan Lee, Chia-Chan Chen | 2020-12-29 |
CL
Ching-Heng Liu
Overall (2020): #515,329 of 565,922Top 95%
1
Patents 2020