Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868244 | Multiple hard mask patterning to fabricate 20nm and below MRAM devices | Yu-Jen Wang, Jesmin Haq, Tom Zhong | 2020-12-15 |
| 10868242 | Sub 60nm etchless MRAM devices by ion beam etching fabricated T-shaped bottom electrode | Dongna Shen, Yu-Jen Wang | 2020-12-15 |
| 10868237 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive R-deposition | Dongna Shen, Vignesh Sundar, Yu-Jen Wang | 2020-12-15 |
| 10840440 | Metal/dielectric/metal hybrid hard mask to define ultra-large height top electrode for sub 60nm MRAM devices | Yu-Jen Wang | 2020-11-17 |
| 10770654 | Multiple spacer assisted physical etching of sub 60nm MRAM devices | Dongna Shen, Yu-Jen Wang | 2020-09-08 |
| 10756137 | MTJ patterning without etch induced device degradation assisted by hard mask trimming | Dongna Shen, Yu-Jen Wang | 2020-08-25 |
| 10714680 | Large height tree-like sub 30nm vias to reduce conductive material re-deposition for sub 60nm MRAM devices | Dongna Shen, Yu-Jen Wang | 2020-07-14 |
| 10714679 | CMP stop layer and sacrifice layer for high yield small size MRAM devices | Zhongjian Teng, Yu-Jen Wang | 2020-07-14 |
| 10680168 | Ion beam etching fabricated sub 30nm vias to reduce conductive material re-deposition for sub 60nm MRAM devices | Dongna Shen, Zhongjian Teng, Jesmin Haq, Yu-Jen Wang | 2020-06-09 |