Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867836 | Wafer stack and fabrication method thereof | Kuei-Sung Chang, Ching-Ray Chen, Yen-Cheng Liu | 2020-12-15 |
| 10850976 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Kuei-Sung Chang, Chia-Hua Chu | 2020-12-01 |
| 10745268 | Method of stiction prevention by patterned anti-stiction layer | Kuei-Sung Chang, Fei-Lung Lai, Cheng-Yu Hsieh | 2020-08-18 |
| 10710871 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2020-07-14 |
| 10688786 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Jiou-Kang Lee, Ting-Hau Wu | 2020-06-23 |
| 10672969 | Thermocouple device | Ming-Hsien Tsai, Fu-Lung Hsueh, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2020-06-02 |
| 10654707 | Method of stiction prevention by patterned anti-stiction layer | Kuei-Sung Chang, Fei-Lung Lai, Cheng-Yu Hsieh | 2020-05-19 |