Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629481 | Method for forming interconnect structure | Bor-Zen Tien, Jhu-Ming Song, Hsuan-Han Lin, Kuang-Hsin Chen, Tzong-Sheng Chang | 2020-04-21 |
ML
Mu-Yi Lin
Overall (2020): #336,948 of 565,922Top 60%
1
Patents 2020