Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629481 | Method for forming interconnect structure | Bor-Zen Tien, Jhu-Ming Song, Kuang-Hsin Chen, Mu-Yi Lin, Tzong-Sheng Chang | 2020-04-21 |
HL
Hsuan-Han Lin
Overall (2020): #445,204 of 565,922Top 80%
1
Patents 2020