Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847490 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho +2 more | 2020-11-24 |
| 10692966 | Deep trench capacitor with scallop profile | Tsui-Ling Yen, Ruei-Hung Jang, Bpin Lo | 2020-06-23 |