Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847490 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, Jui-Mu Cho, Ching-Hou Su +2 more | 2020-11-24 |
| 10759654 | Rough anti-stiction layer for MEMS device | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2020-09-01 |
| 10710872 | MEMS package with roughend interface | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2020-07-14 |
| 10626010 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, Jen-Hao Liu | 2020-04-21 |