Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818609 | Package structure and method for fabricating the same | Harry-Hak-Lay Chuang, Meng-Chun Shih, Ching-Huang Wang, Tien-Wei Chiang | 2020-10-27 |
| 10673461 | Hybrid scheduling and latch-based pipelines for low-density parity-check decoding | Wei Hsiang Tang, Farhana Sheikh | 2020-06-02 |