Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756040 | Semiconductor package with rigid under bump metallurgy (UBM) stack | Ta-Jen Yu, Wen-Sung Hsu | 2020-08-25 |
| 10549017 | Suction disc | Shih Hua Hsiao, Bo-Cheng Huang | 2020-02-04 |