Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756040 | Semiconductor package with rigid under bump metallurgy (UBM) stack | Chi-Yuan Chen, Wen-Sung Hsu | 2020-08-25 |
| 10580747 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2020-03-03 |
| 10573536 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2020-02-25 |
| 10573615 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2020-02-25 |
| 10573616 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2020-02-25 |
| 10553526 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2020-02-04 |