Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580747 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2020-03-03 |
| 10573615 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2020-02-25 |
| 10573616 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2020-02-25 |