Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47923 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Zigmund Ramirez Camacho, Frederick R. Dahilig, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2020-03-31 |