Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651139 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Lionel Chien Hui Tay | 2020-05-12 |
| RE47923 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Frederick R. Dahilig, Lionel Chien Hui Tay, Arnel Senosa Trasporto, Henry Descalzo Bathan | 2020-03-31 |